XPose! Hybrid | MatSet
XPose! Hybrid
  • XPose! Hybrid

  • Hybrid Imaging System for Virtually All Print Forms

Advantages of XPose! Hybrid

  • FOR MULTIPURPOSE APPLICATIONS
  • OPTIONAL FLEXTREME! OPTICS FOR MULTIPLE RESOLUTION UP TO 2'540 DPI
  • NO LOSS OF SPEED WITH PLATE THICKNESS UP TO 6.35 MM
  • EASY LOADING AND UNLOADING
  • NOT DEPENDENT ON SPECIFIC FORMATS
  • HYBRID CONFIGURATION POSSIBLE

 < /span>Lüscher Laser Diode Technology

Fiber coupled laser diodes 380 nm – 980 It operates in the nm range and stands out with its ultra-long service life of up to +15'000 exposure hours. They are completely maintenance-free and do not require an active cooling system.

Fully Automatic and Continuous Calibration

XPose! Includes unique Continuous Calibration Technology (CCT). During exposure, the performance of each laser diode at each wavelength is monitored and automatically adjusted if necessary. Thus, costly, inappropriate risks can be eliminated.

Lowmost Energy Consumption< /span>

Lüscher's patented laser diode technology, It reduces costs and provides lower cost of ownership by ensuring minimum power usage of 2 kW / 2.5 kW. This promotes environmentally friendly production for customers.

fleXtreme! Optics for Multiple Resolution

fleXtreme! The optic is a product developed in-house by Lüscher and allows the desired resolution to be selected. The migration is completely automatic and tailored to the requirements. This means that every job can be displayed at any resolution.

 

Multi-Purpose Applications

  • Rotating screens
  • Letterpress printing plates
  • Waterless offset plates
  • Flexo printing plates
  • Thermal offset printing plates
  • Traditional offset plates
  • Film, diazo and ablative
  • Varnishing / veneer plates

  Current Wavelength

XPose! Almost all printing forms can be processed on a single machine

  • 830 nm IR for thermal offset plates
  • 980 nm IR for any ablative (LAMS) plate or ablative film
  • 405 nm UV can be easily imaged for conventional off

    Makine tipi

    Maksimum Plaka Boyutu

    Maksimum Plaka Kalınlığı

    Makine Boyutları (U x G x Y)

    Ağırlık

    XPose! 330

    Ofset 1'130 x 950 mm (44,4 x 37,4 inç)
    Flekso 1'150 x 950 mm (45,3 x 37,4 inç)

    Ofset 0,2 – 0,4 mm (0,01 – 0,02 inç)
    Flekso 0,76 – 6,35 mm (0,03 – 0,25 inç)

    2'940 x 1'367 x 1'645 mm
    (115,7 x 53,8 x 64,8 inç)

    1.900 kg
    (4.189 lb)

    XPose! 360

    Ofset 1'650 x 1'370 mm (114,5 x 53,9 inç)
    Flekso 1'340 x 1'370 mm (52,7 x 53,9 inç)

    Ofset 0,2 – 0,4 mm (0,01 – 0,02 inç)
    Flekso 0,76 – 6,35 mm (0,03 – 0,25 inç)

    3'624 x 1'565 x 1'752 mm
    (142,7 x 61,6 x 69 inç)

    2'250 kg
    (4'960 lb)

    XPose! 360L

    Ofset 1'650 x 2'260 mm (64,9 x 88,9 inç)
    Flekso 1'340 x 2'260 mm (52,7 x 88,9 inç)

    Ofset 0,2 – 0,4 mm (0,01 – 0,02 inç)
    Flekso 0,76 – 6,35 mm (0,03 – 0,25 inç)

    4'672 x 1'565 x 1'899 mm
    (183,9 x 61,6 x 74,8 inç)

    43'800 kg
    (8'378 lb)

       

    Özellik

    Şartname

    Hibrit konfigürasyonlar

    Gerektiğinde 3 farklı dalga boyuna kadar

    Çözünürlük

    2'400 / 2'540 dpi

    Lazer diyot türleri

    UV, 380 nm/UV, 405 nm/UV, 830 nm/UV, 980 nm

    Lazer diyot sayısı

    16 / 32 / 64 / 96 / 128

    Güç kaynağı

    3 x 400 V + N + PE / 50 – 60 Hz / 32 A

    Hava besleme

    6 – 10 bar, 300 l/dak

    Güç tüketimi

    2 kW / 2,5 kW

    Çevre koşulları

    18 – 25°C'de (64,4 – 77 ° F) %550 – 65 nem

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